JSW Electronic hot melt film

详情描述：

The reactive jsw-Electronic hot melt film is heated and melted into a fluid under the condition of inhibiting chemical reaction to facilitate coating; the adhesive layer agglomerates after two kinds of adherends are bonded and cooled; after Electronic hot melt film reacts with and expands the chain with the help of the moisture in the air and the moisture on the surface of the adherend to form a polymer with high cohesion, making the adhesive force, heat resistance The resistance to low temperature was significantly improved. Because of its high reactivity, Electronic hot melt film shows excellent adhesion to a variety of plastics, PMMA, acrylic, glass, metal and other materials. Electronic hot melt film is used in the electronic and microelectronics industry, tablet frame and touch screen and other plastic substrate bonding.
The above is a brief introduction of Electronic hot melt film. For detailed data, please go to the download window of jinshengwei official website. The following is the informal information of Electronic hot melt film for reference only.

Clear goal: JSWElectronic hot melt film has long established a clear strategic goal-to become a company providing comprehensive technology Electronic hot melt film services, and will unswervingly realize this goal. Comprehensive development enables business to develop at a high speed. Every enterprise is "profit-driven" and is a profit-oriented company. However, JSW's slogan is "long-term benefits" and as long as long as long-term profits can be made, there is no need to worry about short-term losses, and short-term commercial benefits cannot be obtained at the expense of long-term Electronic hot melt film customer relationship. JSW's long-term pursuit of profits has been reflected many times in its development history. Finally got the return of Electronic hot melt film products-becoming the largest Electronic hot melt film manufacturer in the market in 2014.
Since the outbreak of the global financial crisis, some countries have issued Electronic hot melt film trade protection measures under domestic economic pressure. This not only violates the spirit of fair trade, but also directs protectionism against developing economies. Electronic hot melt film Enterprise's Foreign Operation and Development, on the one hand, is the enterprise's efforts; on the other hand, changing its product sales thinking is also the guarantee for its smooth overseas trade. Judging from the current situation, the majority of Electronic hot melt film enterprises need to rely on the enterprises to carry out corresponding support in the initial stage of overseas investment, and obtain success from it. However, in our country, Electronic hot melt film overseas investment is still in its initial stage, so it cannot get corresponding support from local enterprises, which has resulted in Electronic hot melt film enterprises' customers and raw material suppliers unable to get support for overseas investment.

The application period (service life) of Electronic hot melt film is an important process index for testing the quality of adhesive in use. The application period refers to the time from the time Electronic hot melt film melts into fluid by heating to the time when it can maintain its usable performance (e.g. when the viscosity of the glue solution is too low to be applied to the surface of the adherend (not suitable for construction). Determination method: the Electronic hot melt film to be tested is placed at the experimental temperature of (110.5)℃ for at least 10 minutes, in a G17 low-profile beaker with a volume 1/3 larger than the glue amount, starting from the starting time of the application period of Electronic hot melt film. After a certain time interval, according to the national standard, the viscosity measurement and the preparation of adhesive samples are repeated to measure the strength. The viscosity and adhesive strength are plotted against time. The shorter time is determined as the applicable period of Electronic hot melt film when the viscosity of Electronic hot melt film rises abruptly and the adhesive strength falls below the index value.